Enhancing Smartphone Circuit Cooling: A Computational Study of PCM Integration

ABSTRACT

Modern smartphones are used for a variety of demanding tasks, including gaming, high-resolution photography, and internet browsing, which greatly increases their power consumption. This elevated power usage generates more heat within the device, typically ranging from 2 to 6 watts. To manage this heat and maintain optimal performance, smartphones employ several cooling techniques. A new approach to mobile cooling could involve innovative methods such as advanced phase change materials, liquid cooling systems, or emerging technologies like thermoelectric and microfluidic cooling. This paper introduces a new cooling method utilizing phase change materials, which absorb heat by transitioning between solid and liquid states. This technique helps maintain the device’s temperature below 75°C. In mid-range smartphones, cooling techniques such as natural convection, indirect heat-pipe cooling, and forced convection are commonly employed, but these methods often prove inadequate under high-power usage conditions.